Packaging – Miscellaneous

Content

I. Dicing Saw
II.Ball Bonder

 

MC 1006A dicing saw

MC B3 212
  • For chips, 2″, 3″, 4″ and 150mm wafers
  • Silicon cutting up to 0.8mm thickness
  • Quartz cutting up to 1.3mm thickness
  • Square dies or hexagonal dies
 

Standard Operation Procedure

Manual

Dicing Blades

MicroAutomation Hub blades (Tempress) for silicon :
  • Model:12467
  • Serie 401 Dicing Wheel
  • Width of blade is 0.001″ to 0.0015″ (25.4µm to 38.1µm)
  • Blade exposure is 0.025″ to 0.030″ (635µm to 762µm)
  • Outer diameter is 2.187″ (55.55mm)
  • Inside hole diameter is 0.750″ (19.05mm)
  • 5 µm diamond
  • Nickel bonded
Thermocarbon Inc. Hubless blades for Quartz or glass:

These blades are mounted on a Thermocarbon Flange Model 2.187BA-80S or 2.187BA-60S

  • Model: 2.187-8A-40RU-3
  • Dicemaster High Quality Diamond Blades
  • Width of blade is 0.0078″ to 0.0082″ (198µm to 208µm)
  • Blade exposure depends from the used flange. With flange 2.187BA-80S it is 0.080″ (2.032mm) and with flange 2.187BA-60S it is 0.060″ (1.524mm)
  • Outer diameter is 2.187″ (55.55mm)
  • 40µm diamond
  • Resin bonded
     

Dicing Saw

Contact for training: Gaël Osowiecki

 

K&S Ball Bonder 4524

MC B1 147
  • Gold wire ball bonder
  • Manual alignement
  • Semi-automatic bonding
  • 152x152mm bonding area

bonder

Contact for training: Gaël Osowiecki