Category: thermalsoc

Cooling down hotspots – 3D-ICE

3D chips are a great idea – processors placed one on top of the other, for a superfast transmission of data. The trouble is that chips heat up, and if you pile them up they heat up even faster. 3D-ICE is a powerful thermal emulator for three-dimensional computing. Version 3.1 is presented in a new (…)

ACM Fellow Prof. Atienza: Shaping Sustainable Computing & Edge AI

David Atienza, director of the EPFL EcoCloud Center, was interviewed by the organisation Association for Computer Machinery (ACM) on the occasion of a presentation that he gave as a Distinguished Speaker and Fellow. Here is a summary of that conversation. While a core focus of your research has been embedded systems, you have branched out (…)

Thermosyphon – a true Innovation

Innovations developed by our lab have been analysed by the European Commission’s Innovation Radar (see mission statement). One of the researchers involved, Arman Iranfar, explains this ground-breaking technology. Nowadays, data centers with large rooms are filled with a huge number of servers and other IT equipment that account for around 2% of the global energy (…)

ThermoSyphon

ISVLSI 2020 Best Paper Award!

Congratulations to Halima Najibi, Alexandre Levisse, Marina Zapater and David Atienza for winning a best paper award at the IEEE Computer Society Annual Symposium on VLSI. The online presentation: The entire award ceremony: