3D chips are a great idea – processors placed one on top of the other, for a superfast transmission of data. The trouble is that chips heat up, and if you pile them up they heat up even faster.
3D-ICE is a powerful thermal emulator for three-dimensional computing. Version 3.1 is presented in a new publication in IEEE Transactions on Parallel and Distributed Systems, which features a new Dynamic Thermal Management evaluation framework.
Congratulations to Darong Hunag, Luis Costero and David Atienza of ESL for this excellent new publication.
Darong Huang, Luis Costero, David Atienza
An Evaluation Framework for Dynamic Thermal Management Strategies in 3D MultiProcessor System-on-Chip Co-Design
IEEE Transactions on Parallel and Distributed Systems