P. Koutsogiannis; F. Risch; J. A. Pardo; I. Stolichnov; C. Magén
ACS applied materials & interfaces. 2024. Vol. 16, num. 48, p. 66341 – 66349. DOI : 10.1021/acsami.4c11565.F. Risch; A. Gilani; S. Kamaei; A. M. Ionescu; I. Stolichnov
Applied Physics Letters. 2024. Vol. 125, num. 15, p. 152902. DOI : 10.1063/5.0232620.Y. C. Sprunger; L. Capua; T. Ernst; S. Barraud; D. Locca et al.
Biosensors-Basel. 2023. Vol. 13, num. 10, p. 908. DOI : 10.3390/bios13100908.S. Kamaei; M. Ghini; A. Gilani; C. Gastaldi; E. Collette et al.
Ieee Electron Device Letters. 2023. Vol. 44, num. 9, p. 1579 – 1582. DOI : 10.1109/LED.2023.3296945.S. Kamaei; X. Liu; A. Saeidi; Y. Wei; C. Gastaldi et al.
Nature Electronics. 2023. DOI : 10.1038/s41928-023-01018-7.D-S. Park; A. D. Rata; R. T. Dahm; K. Chu; Y. Gan et al.
Advanced Materials. 2023. DOI : 10.1002/adma.202300200.F. Qaderi; T. Rosca; M. Burla; J. Leuthold; D. Flandre et al.
Communications Materials. 2023. Vol. 4, num. 1, p. 34. DOI : 10.1038/s43246-023-00350-x.C. Gastaldi; S. Kamaei; M. Cavalieri; A. Saeidi; I. Stolichnov et al.
Ieee Electron Device Letters. 2023. Vol. 44, num. 4, p. 678 – 681. DOI : 10.1109/LED.2023.3249972.D. E. Tranca; S. G. Stanciu; R. Hristu; A. M. Ionescu; G. A. Stanciu
Applied Surface Science. 2023. Vol. 623, p. 157014. DOI : 10.1016/j.apsusc.2023.157014.R. Paul; V. Conti; M. Zamani; S. Escobar-Steinvall; H. Sanchez-Martin et al.
Solar Energy Materials And Solar Cells. 2023. Vol. 252, p. 112194. DOI : 10.1016/j.solmat.2023.112194.F. Bersano; M. Ghini; I. Bouquet; E. Collette; N. Martinolli et al.
2024. 50th IEEE European Solid-State Electronics Research Conference, Bruges, Belgium, 2024-09-09 – 2024-09-12. p. 165 – 168. DOI : 10.1109/ESSERC62670.2024.10719596.A. Gilani; A. Saeidi; S. Sheibani; J. Longo; S. Kamaei et al.
2024. IEEE BioSensors Conference, Cambridge, United Kingdom, 2024-07-28 – 2024-07-30. DOI : 10.1109/BioSensors61405.2024.10712663.A. Gilani; A. Saeidi; J. Longo; Y. Sprunger; S. Kamaei et al.
2024. IEEE Sensors, Kobe, Japan, 2024-10-20 – 2024-10-23. DOI : 10.1109/SENSORS60989.2024.10785129.F. Bersano; M. Aldeghi; E. Collette; M. Ghini; F. D. Palma et al.
2023. 2023 IEEE Symposium on VLSI Technology and Circuits, Kyoto, Japan, 2023-06-11 – 2023-06-16. p. 1 – 2. DOI : 10.23919/VLSITechnologyandCir57934.2023.10185278.N. Yakymets; R. Zanetti; M. A. Ionescu; D. Atienza Alonso
2023. 45th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Sydney Australia, July 24-27, 2023. DOI : 10.1109/EMBC40787.2023.10340131.N. Bidoul; T. Rosca; A. M. Ionescu; D. Flandre
2023. IEEE 53rd European Solid-State Device Research Conference (ESSDERC), Lisbon, PORTUGAL, SEP 11-14, 2023. p. 81 – 84. DOI : 10.1109/ESSDERC59256.2023.10268509.Y. C. Sprunger; L. Capua; T. Ernst; S. Barraud; A. M. Ionescu et al.
2023. IEEE 49th European Solid-State Circuits Conference (ESSCIRC), Lisbon, PORTUGAL, SEP 11-14, 2023. p. 153 – 156. DOI : 10.1109/ESSCIRC59616.2023.10268731.F. Qaderi; Y. Horst; T. Blatter; M. Burla; D. Park et al.
2022. 47th International Conference on Infrared, Millimeter and Terahertz Waves (IRMMW-THz), Delft, NETHERLANDS, Aug 28-Sep 02, 2022. DOI : 10.1109/IRMMW.THz50927.2022.9895513.S. Kamaei; A. Saeidi; X. Liu; C. Gastaldi; C. Moldovan et al.
2022. 48th IEEE European Solid State Circuits Conference (ESSCIRC), Milan, ITALY, Sep 19-22, 2022. p. 161 – 164. DOI : 10.1109/ESSCIRC55480.2022.9911286.F. Bersano; F. De Palma; F. Oppliger; F. Braakman; I. Radu et al.
2022. 48th IEEE European Solid State Circuits Conference (ESSCIRC), Milan, ITALY, 2022-09-19 – 2022-09-22. p. 49 – 52. DOI : 10.1109/ESSCIRC55480.2022.9911479.