Contents
I. Introduction ↑
The EVA 451 is an evaporator dedicated to the coating of conductive layers to prepare non-conductive samples to e-beam exposure and avoid any charging issues.
The tool is composed of a loadlock and a chamber with 4 boats.
A shuttle is used to carry the sample IN/OUT:
- Chips : Please use the dedicated shuttle and accessories to mount and secure the chip on top of the shuttle.
- 100 mm wafers: As standard.
- “Thick” 100 mm wafers: If the thickness of the wafer exceeds 700 um, please use the shuttle for chips instead.
- 150 mm wafers: Not available yet.
II. Equipment description ↑
Loadlock
The robot located into the loadlock handles the loading and unloading of the shuttle.
Substrate fixture
The fixture in rotation during the coating is actively cooled down to prevent the heating of the sample.
Pumping
Pumping in the system is achieved by:
- Loadlock:
- Primary pump: Dry pump – Pfeiffer-ACP28G
- Secondary pump: Turbo pump – Pfeiffer-HiPace300
- Chamber:
- Primary pump: Dry pump – Pfeiffer-ACP040G
- Secondary pump: Turbo pump – Pfeiffer-ATH1603M
Pressure
- Chamber :
- 1 x Full Range Gauge: INFICON BCG 450
- Loadlock :
- 1 x Full Range Gauge: INFICON BCG 450
Sources
There are in total 4 x thermal sources (Max. current: 480A / Max. voltage: 8V).
Note: The source n°3 is equipped with a crystal quartz below the shutter to be able to accurately adjust the deposition rate even before starting the coating of the sample.
III. Recipes ↑
| Recipe | Source [#] | Material | Dep. rate [A/s] | Fixture rotation [rpm] | Max. Thickness [kA] |
|---|---|---|---|---|---|
| EJ2_Cr_2.0As | 2 | Cr | 2.0 | 5 | 0.3 |
| EJ3_Cr_1.0As | 3 | Cr | 1.0 | 5 | 0.3 |
| EJ3_Cr_2.0As | 3 | Cr | 2.0 | 5 | 0.3 |
| EJ4_Cr_2.0As | 4 | Cr | 2.0 | 5 | 0.3 |
IV. How to use the system ↑
All the actions to operate the system are detailed in the user manual.
