– 100, 150 mm wafers – Silicon, glass and pyrex wafers – Other materials on demand – Maximum thickness 1 mm on silicon and 2.4 mm on glass and pyrex – Location: Zone 9
Thermal NIL up to 250°C UV NIL @365nm or 405nm (with temperature up to 200°C) Imprint in vacuum (~1mbar) Uniform pressure (up to 6.5bar) applied trough a membrane Replicable structures : ~40nm up to 100um
– Vertically air-pressurized cylinder – Temperature up to 200 °C – Imprinting intensity up to 3 kN – Imprinting area up to 150×150 mm – Location: Zone 11
Quick stick 135 is a wax used for temporary sticking of a wafer, or pieces of wafer, on a dummy wafer in order to make processing like photolithography or etching.
It is mainly used for: – Photolithography on fragile wafer or wafer with holes or deep cavities on back side – Dry etching on chips
– Hot rolls laminators – Accurately controlled heat, pressure, speed – Quick and easy wafer processing – ALPHA940 and ALPHA920 dry films – Location: back of Zone 1
– Not microelectronic, not biocompatible compatible – Temperature range: 150 to 1000°C – Maximum heating and cooling rate : 100°C/min – Chamber with gas extraction – Sweeping gas available: N2 or forming gas (3% H2 in N2) – Vacuum for purge cycles – Sample size: 10 alumina 5inch square plates available, possibility to load 10 wafers 100mm in diam. – Location: Zone 10
– Not microelectronic, not biocompatible compatible vaccumed chamber: less than 5 mbar – Temperature range: 50 to 450°C – Maximum heating: 200°C/min – Maximum cooling rate : 100°C/min – Chamber with gas extraction – Process chamber size: 147mm x 217mm height 40mm – Location: Zone 10
