Metrology

AFM

Equipement
– 150mm X 180mm inspectable area with rotating chuck
– Automated laser and detector alignment
– <30pm vertical noise with closed-loop Icon scanner
– High speed imaging with FastScan scanner
– Location: Zone 15
Documentation
Manual
Responsibles
D. Bouvet
A. Toros

FIB / SEM / EDX / ProSEM

Equipement
– 100, 150 mm wafers and piece parts
– High resolution SEM imaging
– Ion beam patterning (> 100nm)
– Up to 30 kV SEM and FIB acceleration voltages
– Cross-sections, TEM lamellas, Omniprobe manipulator
– Location: Zone 8
Documentation
Manual
Responsibles
Z. Benes
J. Pernollet
Equipement
– 100 wafers, cleaved samples and piece parts
– High resolution SEM imaging (<1nm)
– From 0.02 to 30 kV acceleration voltage
– SE, In-Lens and Energy Selective Backscatter detectors
– EDX Analysis
– Location: Zone 15
Documentation
Manual
Responsibles
Z. Benes
M. Chahid
Equipement
– Energy Dispersive X-ray Spectroscopy
– Oxford Instruments X-MAX silicon drift type detector 50mm2
– Resolution 127eV FWHM
– Detection limit about 1 atomic %
– AZtec and INCA software
– Location: Zone 15
Documentation
Manual
Responsibles
Z. Benes
J. Pernollet
Equipement
– 6 & 5 inch masks; 8, 6 & 4 inch wafers, cleaved samples (wafer section) and piece parts
– High resolution SEM imaging (<1nm)
– From 0.02 to 30 kV acceleration voltage
– Detectors: SE, In-Lens, EsB, aBSD and VPSE
– Additional softwares: SmartStitch, 3DSM & MountainsMap, ProSEM
– Location: Zone 15
Documentation
Manual
Responsibles
M. Chahid
Z. Benes
Equipement
– GenISysSEM image analysis software
– CD and line-edge roughness measurements
– Automatic pattern edge detection
– Multiple features in a single image analysis
– Batch processing of multiple images
– Location: BM1132
Documentation
Manual
Responsibles
Z. Benes
J. Pernollet

XPS / AES available at MHMC

Please visit “Surface characterization” MHMC page for more details.

Please visit “Surface characterization” MHMC page for more details.

Mechanical profilometers

Equipement
– Measurement range in Z : 1 mm
– Spacial resolution : 0.5 µm
– Location: Zone 4
Documentation
Manual
Brochure
Datasheet
Responsibles
D. Bouvet
A. Toros
Equipement
– Measurement range in Z : up to 1mm
– Step height repeatability: 5A
– 3D stress and 3D mapping
– Location: Zone 15
Documentation
Manual
Tutorial for database
Responsibles
D. Bouvet
A. Toros
Equipement
– Measurement range in Z : up to 1mm
– Step height repeatability: 20A
– Location: Zone 19
Documentation
Manual
Responsibles
D. Bouvet
A. Toros

Optical measurement

Equipement
– Contact Angle and Surface Free Energy (SFE) measurements
– Multi-dosing system (4 automatic and 1 manual syringes)
– Motor-controlled y– axis for multi-drop experiments
– Droplet volume < 5 µl
– Location: Zone 16
Documentation
Equipment Description

User Manual
Responsibles
J. Dorsaz
N. Piacentini
M. Pillon
Equipement
– Measurement range : 1 nm and more
– Multi-layers measurements
– Spectral range: 210nm to 2500nm
– Location: Zone 4
Documentation
Manual
Responsibles
R. Juttin
B. Cuénod
Equipement
– Phase shifting interferometry (PSI) for roughness and small steps (< 135 nm)
– Vertical scanning interferometry (VSI) for rough surface and steps up to 10 mm high
– PSI vertical resolution : <0.01 nm
– VSI vertical resolution : <0.75 %
– Spacial resolution : 0.38 µm
– Location: Zone 15
Documentation
Manual
Responsibles
C. Hibert
A. Toros
Equipement
– Thickness measurement
– Thickness range : 1nm to 40µm
– Thickness and n and k measurement
– Thickness range : 50nm and up
– Wavelength range : 200nm – 1100nm
– Spot size : 1.5mm
– Measurement of Single layers
– Measurement of Multilayer stacks
– Location: Zone 11
Documentation
Manual
Responsibles
J. Dorsaz
N. Piacentini
M. Pillon
Filmetrics F54-XY-200
Equipement
– Measurement range : 4nm up to 35µm
– Spatial resolution : 33µm (500um aperture)
– Mono, bi-layers and tri-layer stack measurements
– Location: Zone 3 & Zone 19
Documentation
Full Manufacturer’s Manual
Operations Manual
Responsibles
D. Bouvet
A. Toros
Equipement
– Thin film stress measurement
– Location: Zone 15
Documentation
Manual
Responsibles
C. Hibert
B. Cuénod

Electrical measurement

Equipement
– AC and DC impedance measurements with up to 4 probes
– Tungsten tips with 12 and 7 µm radius
– Stage travel with fine and coarse mode, up to 150mm x 150mm
– Instruments: Agilent 4155B SPA (DC), Zürich Instruments MFIA (AC)

– Location: Zone 11
Documentation
Equipment Description

MPI TS150 User Manual
Responsibles
J. Dorsaz
N. Piacentini
M. Pillon
Equipement
– Compatible layers : Metal, Conductive Oxide, Silicon and Polysilicon.
The tool is configured by default for the metallic layers and for sample thickness of 525 um +/- 25 um.
If you are not in this configuration, please contact CMi staff

– Measurement range : 5 mOhm/sq to 5MOhm/sq
– Measurement area : 10x 10 to 200 x 200 mm
– Accuracy : +/- 1%
– Repeatability : < 0.5 %
– Temperature compensation
– 2D and 3D mapping
– Location: Zone 4
Documentation
Manual
Responsibles
D. Bouvet
A. Toros
Equipement
– Compatible layers : Metal, Conductive Oxide, Silicon and Polysilicon.
The tool is configured by default for the metallic layers and for sample thickness of 525 um +/- 25 um.
If you are not in this configuration, please contact CMi staff

– Measurement range : 1 mOhm/sq to 2 MOhm/sq
– Measurement area : up to 8”/200 mm wafer, up to 6 mm thickness
– Accuracy : +/- 0.5%
– Temperature compensation
– 2D and 3D mapping
– Location: Zone 18
Documentation
Specifications
Manual
Responsibles
D. Bouvet
A. Toros

Optical microscopy

Equipements
List of microscopes at CMi
Documentation
Manual Leica D800