To be read first:
- Solvent chemistry: Do not breath unsafe NMP solvent vapor during polyimide processing.
- Hotplates: Make sure to open exhaust lines when operating.
- Please immediately inform the CMi staff in case of problems with the equipment.
RESERVATION RULES AND BOOKING FEES POLICY:
- Reservation names must correspond to operators.
Contents:
I. Introduction
The Sawatec manual coater line in Zone 6 is composed of a Sawatec LSM-200 coating unit and two Präzitherm hotplate units. The line is dedicated to the coating and softbake of polyimide (PI) or polybenzoxazole (PBO) polymers.
CMi currently provides and maintain process parameters for the following grades: PI 2610, PI 2611 (from HD MicroSystems)
The two Präzitherm hotplates are used to apply a short softbake process of the PI coated wafers: 3 minutes @ 65 °C and 3 minutes @ 105 °C.
The high-temperature polyimide full curing step is not performed on the hotplates but on the Heraeus T6060 in Zone 11: Heraeus T6060
II. Equipment description
Technical characteristics:
Sawatec LSM-200 coater:
- Manual loading and unloading of the substrates
- Substrate fixation via vacuum and safety interlock protection
- Speed range: 1 to 6’000rpm +/-1rpm
- Difference from set rotation speed to actual value <+/-1%
- Speed acceleration: 0 – 6’000rpm in 0,6 sec
- Rotational direction can be selected (CW, CCW)
- Top glass cover to prevent splashing and enhance coating uniformity
- Up to 50 recipes with 24 segments each can be programmed
Available chucks:
The coater is designed to handle wafers up to 8” or substrates up to 6” x 6” (150 x 150mm), using different chuck models which are easily interchangeable.
Two chucks are available by default: one for 4” wafers and one for smaller samples/chips down to 10x10mm. Two additional chucks for 3” and 6” wafers are shared between the Sawatec LSM tools.
Präzitherm hotplates:
- Precision hotplates PTZ 28-2 ET
- Maximum tempearture 350 °C, precision +/- 0.5 °C
- Hotplate surface 280 mm x 200 mm
- 1x additional coolplate
Process:
The documentation for the PI process is found here: