Sawatec LSM-250 & HP-200

To be read first:

  • Maintenance period for cleaning is scheduled every thursday morning. The coater is not available during this period.
  • Please immediately inform the CMi staff in case of problems with the equipment.

RESERVATION RULES AND BOOKING FEES POLICY:

  1. No booking restrictions.
  2. 24/7 booking/use is possible with CMi+1 extended access.
  3. Reservation names must correspond to operators.

Contents:

  1. Introduction
  2. Equipement description
  3. Users manuals
  4. Links
  5. Pictures gallery

I. Introduction

The Sawatec manual coater line in Zone 13 is composed of a Sawatec LSM-250 coating unit and two HP-200 hotplate units.

The coater is designed to handle wafers up to 8” or substrates up to 6” x 6” (150 x 150mm), but also small sample/chips, using different chuck models which are easily interchangeable.

The hotplate is a robust and modular system offering good uniformity and process repeatability for softbake, PEB or hardbake steps. It can be loaded with up to four 4″ wafers that will be processed simultaneously.

In CMi, the Sawatec coater line in Zone 13 is dedicated to the coating and bake steps of:

  1. SU-8 photosensitive epoxy resist (from Gersteltec or Kayaku)
  2. Modified SU-8.

II. Equipment description

Technical characteristics:

Sawatec LSM-250 coater:

  • Manual loading and unloading of the substrates
  • Special chuck for small chips
  • Substrate fixation via vacuum and safety interlock protection
  • Speed range: 1 to 6’000rpm +/-1rpm
  • Difference from set rotation speed to actual value <+/-1%
  • Speed acceleration: 0 – 6’000rpm in 0,6 sec
  • Rotational direction can be selected (CW, CCW)
  • Top glass cover to prevent splashing and enhance coating uniformity
  • Up to 50 recipes with 24 segments each can be programmed

Available chucks:

Two chucks are available by default: one for 4” wafers and one for smaller samples/chips down to 10x10mm. Two additional chucks for 3” and 6” wafers are shared between the Sawatec LSM tools.

Sawatec HP-200:

  • Manual loading and unloading of the substrates
  • Substrate fixation via vacuum
  • Temperature range: ambient temperature up to 250°C
  • Temperature accuracy: +/- 0.5°C at 100°C
  • Optional N2 flushing
  • Up to 50 recipes with 24 segments each can be programmed

Process:

The documentation for the SU-8 process is found here:

III. User manuals

IV. Links

V. Pictures gallery