Please download the polyimide runcard to find parameters for all processing steps (HD Microsystems PI series):
Process flow
| Recommended process | Alternative process |
|
| Unfreeze Resist |
Take the PI bottle out of the freezer at least 1 hour before use. The PI polymer deteriorates at each thermal cycle (warm-up & freeze). Put a mark on the dose after each use, do not use a dose for more than 5 work sessions. |
|
| Substrate Pretreat |
Oxygen plasma Thermal dehydration – (Süss Hotplates, Z06) |
Piranha cleaning |
| VM652 Silanization (optional) |
Manual coating (Sawatec LSM200, Z06) |
|
| PI Coating | Manual coating (Sawatec LSM200, Z06) |
|
| Soft Bake | Option 1 (fast): 65° 3 minutes + 105° 3 minutes (Süss Hotplates, Z06) |
Option 2 (low stress): slow ramp to 120°C (Sawatec HP401Z, Z11) |
| Curing | Oven curing (Heraeus T6060, Z11) |