Please download the SU-8 runcard to find parameters for all processing steps (Gersteltec GM and Kayaku 3000 series):
Process flow
| Recommended process | Alternative process |
|
| Substrate Pretreat | Oxygen plasma (Tepla 300, Z11) |
Piranha cleaning (Wet bench, Z02) |
| Coat | Manual coating (Sawatec LSM250, Z13) |
|
| Edge Bead Removal (optional) | Manual EBR (Sawatec LSM250, Z13) |
|
| Relaxation + Soft Bake | Hotplate soft baking (Sawatec HP200, Z13) |
|
| Expose |
i-line exposure (MJB4, Z13 or MA6 Gen3, Z01) Direct laser writing, 365nm (MLA150-2, Z16) |
Broadband exposure |
| Post Exposure Bake (PEB) | Hotplate baking (Sawatec HP200, Z13) |
|
| Develop | Manual development in PGMEA (Solvent Bench, Z13) |
|
| Rinse & Dry | Rinse with isopropanol, dry with nitrogen gun | Isopropanol + spin rinse dry (Semitool SRD, Z01) |
| Hard Bake (optional) | Hotplate curing (Sawatec HP200, Z13) |
Oven curing (Heraeus oven, Z1) |
| Observation | Microscopes |
