{"text_format":"1","workbook":"xlsx","n_sheets":9,"sheets":["Summary","Runcard","PI2610","PI2611","PI2525","Results PI2610","Results PI2611","Results PI2525","Setup"],"not_rendered":{"charts":7,"images":0,"macros":1,"external_links":0,"defined_names":0,"comments":0,"pivot_tables":0},"unopened":[{"sheet":"PI2610","index":2,"reason":"not_a_worksheet"},{"sheet":"PI2611","index":3,"reason":"not_a_worksheet"},{"sheet":"PI2525","index":4,"reason":"not_a_worksheet"}],"bounds":{"document_bytes":16777216,"sheet_cells":100000,"rows_first":2000,"rows_last":500,"rows_between":2000,"halvings":0,"cell_chars":16384,"cell_head_chars":4096},"cells_cut":0,"cells_raw":0,"read":"whole","date_system":"1900"}

{"sheet":"Summary","index":0,"n_rows":33,"n_cols":15,"rows_kept":33,"cut":false,"hidden":false,"merged":[[16,10,17,11],[21,1,22,2],[20,4,20,5],[18,13,19,14],[3,10,3,11],[4,10,4,11],[5,10,5,11],[20,7,20,8],[18,10,19,11],[16,13,17,14],[18,1,19,2],[6,4,6,5],[18,4,19,5],[18,7,19,8],[8,4,8,5],[16,1,17,2],[16,4,17,5],[16,7,17,8]]}
[]
[]
[]
[null,"Polymide Processing - HD Microsystems PI series",null,null,null,null,null,null,null,null,"Layer Stack - Example"]
[null,null,null,null,null,null,null,null,null,null,"PI 2611 - 1500rpm (~11um)"]
[null,null,null,null,null,null,null,null,null,null,"After Step 4 repeat directly Step 3 "]
[null,null,"Substrate :",null,"Pyrex or Float glass",null,null,null,null,null,"Layer 1","11.1um"]
[null,null,null,null,null,null,null,null,null,null,"Layer 2","22.7um"]
[null,null,"Resist : ",null,"PI 2610 or 2611",null,null,null,null,null,"Layer 3","33.8 um"]
[null,null,null,null,null,null,null,null,null,null,"Layer 4","45 um"]
[null,null,"Target thickness :",null,11]
[]
[]
[]
[]
[]
[null,"1. Wafer Preparation",null,null,"2. Primer ",null,null,"3. Coating",null,null,"4. Pre-bake",null,null,"5. Curing"]
[]
[null,"Ultrafab Piranha (Z2)",null,null,"Sawatec coater (Z6)",null,null,"Sawatec coater (Z6)",null,null,"Süss Hotplates (Z6)",null,null,"Heraeus oven (Z11)"]
[]
[null,null,null,null,"VM 652",null,null,"PI 2611",null,null,"time [s]","temperature [°C]",null,"N2","ON above 200°C "]
[null,null,null,null,"time [s]","speed [rpm]",null,"time [s]","speed [rpm]",null,180,"65°",null,"Pr ",1]
[null,null,null,null,"10s","500rpm",null,5,500,null,180,"105°",null,"n",4]
[null,null,null,null,"30s","3000rpm",null,5,500,null,null,null,null,"r",0]
[null,null,null,null,null,null,null,{"$f":"(Setup!C2-500)/100","v":10.3},{"$f":"Setup!C2","v":1530},null,null,null,null,"P0",50]
[null,null,null,null,null,null,null,40,{"$f":"Setup!C2","v":1530},null,null,null,null,"T1",0.3]
[null,null,null,null,null,null,null,1,{"$f":"(Setup!C2)+1000","v":2530},null,null,null,null,"P1",200]
[null,null,null,null,null,null,null,1,{"$f":"Setup!C2","v":1530},null,null,null,null,"T2",1]
[null,null,null,null,null,null,null,5,{"$f":"Setup!C2","v":1530},null,null,null,null,"P2",200]
[null,null,null,null,null,null,null,{"$f":"Setup!C2/100","v":15.3},0,null,null,null,null,"T3",0.25]
[null,null,null,null,null,null,null,0,0,null,null,null,null,"P3",300]
[null,null,null,null,null,null,null,null,null,null,null,null,null,"T4",1]
[null,null,null,null,null,null,null,null,null,null,null,null,null,"P4",300]

{"sheet":"Runcard","index":1,"n_rows":27,"n_cols":5,"rows_kept":27,"cut":false,"hidden":false,"merged":[[19,0,19,3],[24,0,24,3],[1,1,1,4],[10,0,10,2],[14,0,14,3]]}
["Step N°","Description","Equipment","Program / Parameters","Remarks"]
["X","PHOTOLITHOGRAPHY - Mask X"]
[{"$f":"CONCATENATE(LEFT($A$2,3),\".1\")","v":"X.1"},"Wafer preparation","-","Depends on the substrate; see tables below.","Available options:\n- dehydration by hotplate or oven\n- oxygen plasma\n- pirahna cleaning\n\nMake sure to allow dose to "]
[{"$f":"CONCATENATE(LEFT($A$2,3),\".2\")","v":"X.2"},"Primer deposition","Z6 / Plade divers","Spinning with BLE spinner: \n10 s @ 500 RPM, nitrogen off\n30 s @ 3000 RPM, nitrogen on (manual)","Dilute VM 651 in IPA: 1:200.\nLabelled beaker is available. Use pipette to measure 1 ml of VM651, and add to 200 ml of IPA.\nLeave primer puddle on wafer for 30 s before start of spinning.\nWhen finished, clean beaker properly with acetone. Dispose of the waste immediately."]
[{"$f":"CONCATENATE(LEFT($A$2,3),\".3\")","v":"X.3"},"Coating","Z1/Sawatec Coater","Segment 1: Time: 5s / Speed: 500rpm\nSegment 2: Time: 5s / Speed: 500rpm\nSegment 3: Time: ((X-500)/100)s / Speed: Xrpm\nSegment 4: Time: 40s / Speed: Xrpm\nSegment 5: Time: 1s / Speed: X+1000rpm\nSegment 6: Time: 1s / Speed: Xrpm\nSegment 7: Time: 5s / Speed: Xrpm\nSegment 8: Time: (X/100)s / Speed: 0rpm\nSegment 9 -> 24 : Time: 0s / Speed: 0rpm","Reserve Sawatec machine with PI configuration in advance.\nCheck the \"PI processing\" label to be present on the tool.\n\nX is the speed needed to get the desired thickness. Use \"Results\" sheets to determine X.\n\nUse dedicated tools for transferring wafers to hotplate."]
[{"$f":"CONCATENATE(LEFT($A$2,3),\".4\",\"A\")","v":"X.4A"},"PR soft bake (slow version)","Z1/Sawatec Hotplate","Segment 1: Time: 10s / Temp.: 30°C\n                      Base Temp.: 30°C / Vaccum: ON / N2: ON / Pin: Down\nSegment 2: Time: 1800s / Temp.: 75°C\n                      End segment: OFF / Vaccum: OFF / N2: ON / Pin: Down\nSegment 3: Time: 2700s / Temp.: 120°C\n                      End segment: OFF / Vaccum: OFF / N2: ON / Pin: Down\nSegment 4: Time: 300s / Temp.: 120°C\n                      End segment: OFF / Vaccum: OFF / N2: ON / Pin: Down\nSegment 5: Time: 1200s / Temp.: 30°C\n                      End segment: ON / Vaccum: OFF / N2: ON / Pin: Down\nSegment 6 -> 24: NO INFLUENCE","Use the \"CMI 2610\" or \"CMI 2611\" recipe.\n\nThis recipe can be used on the Dataplate as well. \nDO NOT OPEN the cover as long as the Dataplate hotplate is above 30°C, due to the high concentration of the evaporated NMP solvent.\n\nClean the inside area of the Sawatec cover before and after the process with a cleanroom wipe."]
[{"$f":"CONCATENATE(LEFT($A$2,3),\".4\",\"B\")","v":"X.4B"},"PR soft bake (fast version)","Z1/Suss hotplates","Step 1: Time: 180s / Temp.: 65°C\nStep 2: Time: 180s / Temp: 105°C","Set two hotplates to their repective process temperature and allow to stabilize.\n\nAfter use, put the set point of the hotplates back to room temperature."]
[{"$f":"CONCATENATE(LEFT($A$2,3),\".5\")","v":"X.5"},"PR curing","Z2/Heraeus oven","N2 ON above 200°C\nPr=1\nn=4\nr=0\nP0=50\nT1=0.30\nP1=200\nT2=1.00\nP2=200\nT3=0.25\nP3=300\nT4=1.00\nP4=300","This program takes 5 hours for the wafers to cool below 50°C. Make sure nitrogen flow is on."]
[]
[]
[]
[]
[]
[]
["Si  and any other material, except mentioned below"]
["Step N°","Description","Equipment","Program / Parameters","Remarks"]
[{"$f":"CONCATENATE(LEFT($A$2,3),\".1\")","v":"X.1"},"Wafer preparation","Z2/Tepla","Prog. 5","7 min"]
[]
[]
["Metallic layer (in case oxydation of the metallic layer may be a problem)"]
["Step N°","Description","Equipment","Program / Parameters","Remarks"]
[{"$f":"CONCATENATE(LEFT($A$2,3),\".1\")","v":"X.1"},"Wafer preparation","Z6/RC8 entrance or\nZ2/Heraeus oven","10 min","Only dehydration\n"]
[]
[]
["Pyrex or Float glass"]
["Step N°","Description","Equipment","Program / Parameters","Remarks"]
[{"$f":"CONCATENATE(LEFT($A$2,3),\".1\")","v":"X.1"},"Wafer preparation","Z2/Ultrafab piranha or Z2/Tepla","\nProg. 5","Highly recommended\n7 min"]

{"sheet":"Results PI2610","index":5,"n_rows":13,"n_cols":3,"rows_kept":13,"cut":false,"hidden":false,"merged":[]}
["PI2610 on Si"]
["Spin speed\n[rpm]","Film Thickness\n[um]"]
[1500,4.3920000000000003,4.63]
[3000,2.02,2.27]
[4500,1.272,1.33]
["Date",2022,2024]
[]
[]
[]
[]
[]
["Desired\nthickness\n[um]","Spin speed\n[rpm]"]
[{"$f":"Summary!E11","v":11},{"$f":"(A13/17493.7326139947)^(-1/1.12388038844015)","v":705.6732743334527}]

{"sheet":"Results PI2611","index":6,"n_rows":13,"n_cols":3,"rows_kept":13,"cut":false,"hidden":false,"merged":[]}
["PI2611 on Si"]
["Spin speed\n[rpm]","Film Thickness\n[um]"]
[4500,3.4830000000000001,3.48]
[3000,5.48,5.4]
[1500,11.22,11.25]
["Date",2022,2024]
[]
[]
[]
[]
[]
["Desired\nthickness\n[um]","Spin speed\n[rpm]"]
[{"$f":"Summary!E11","v":11},{"$f":"(A13/27593.7261543994)^(-1/1.06703396126684)","v":1534.1119288689033}]

{"sheet":"Results PI2525","index":7,"n_rows":13,"n_cols":2,"rows_kept":13,"cut":false,"hidden":false,"merged":[]}
["PI2525 on Si"]
["Spin speed\n[rpm]","Film Thickness\n[um]"]
[4500,4.0759999999999996]
[3000,6.258]
[1500,12.98]
[]
[]
[]
[]
[]
[]
["Desired\nthickness\n[um]","Spin speed\n[rpm]"]
[{"$f":"Summary!E11","v":11},{"$f":"(A13/28935)^(-1/1.054)","v":1757.158781063572}]

{"sheet":"Setup","index":8,"n_rows":5,"n_cols":4,"rows_kept":5,"cut":false,"hidden":false,"merged":[]}
["Substrate","Resist","Speed ","Max Thickness"]
["Si","PI 2610 or 2611",{"$f":"ROUNDDOWN(C3,-1)","v":1530},12]
["Mettalic layer","PI 2525",1534.1119288689033]
["Pyrex or Float glass"]
["Other"]