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Scribing Head
- Z motion with adjustable angle
- Adjustable scribing force from 3gr up to 50gr; constant weight
- Diamond Tool: Adjustable for angle & rotation
- Tool Offset with cross-hair
Wafer Table
- Wafer chuck till 3’’
- Die Size: Minimum 200um square up to 10mmx10mm
- Wafer thickness: 100um and up
- Rotation alignment by micrometric screw
- X Y Table / resolution 1um
- Manual rotation 90 degrees
- Motion control with progressive joystick weight
Vision System
- Optics & magnification compatible with application (1 to 4x)
- Alignment: Programmable area / Manual
- Target generator
Breaker
- Break mode: operator control or automatic
- Breaking mode: Using top Mylar surface and bottom cutter
- Mylar: removable to avoid contamination
- Target generator
Parameters
- Step Index
- Y scribe speed from 0.1 to 20 mm/sec
- Scribing length programmable
- Repeat scribe
- Number of scribe
- Component number
- Touchdown speed
- Cutter speed