JFP Model 100 – 3 inches Wafer Scriber/Breaker

Scribing Head

• Z motion with adjustable angle
• Adjustable scribing force from 3gr up to 50gr; constant weight
• Diamond Tool: Adjustable for angle & rotation
• Tool Offset with cross-hair

Wafer Table

• Wafer chuck till 3’’
• Die Size: Minimum 200um square up to 10mmx10mm
• Wafer thickness: 100um and up
• Rotation alignment by micrometric screw
• X Y Table / resolution 1um
• Manual rotation 90 degrees
• Motion control with progressive joystick weight

Vision System

• Optics & magnification compatible with application (1 to 4x)
• Alignment: Programmable area / Manual
• Target generator

Breaker

• Break mode: operator control or automatic
• Breaking mode: Using top Mylar surface and bottom cutter
• Mylar: removable to avoid contamination
• Target generator

Parameters

• Step Index
• Y scribe speed from 0.1 to 20 mm/sec
• Scribing length programmable
• Repeat scribe
• Number of scribe
• Component number
• Touchdown speed
• Cutter speed