The Sample Preparation Lab is equipped with a diverse range of tools for etching, polishing, and cutting crystals with precision. The facility ensures meticulous preparation to achieve optimal surface finishes and dimensions for each crystal.
Example of preparation of a (110) oriented lamella of Cu₂OSeO₃ with 4nm surface roughness
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To prepare a thin lamella oriented along a specific crystallographic plane, the process begins by glueing the crystal to a polishing head along the selected facet of the crystal. The precise crystallographic plane is then determined with the help of a Laue camera and a goniometric head that is compatible with the polishing head.
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After the crystal is cut parallel to the desired crystallographic plane using a disc saw, the thin lamella undergoes polishing. This process can reduce the surface roughness to just a few nanometers. X-ray diffraction analysis confirms that the lamella remains undamaged throughout the glueing, cutting, and polishing stages.